Electronic Materials

EW8002 NoSWEEP™ Wire Bond Encapsulant

EW8002 NoSWEEP™ Wire Bond Encapsulant structure
CAS No.
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Cat. No.
EP01111
Molecular Weight
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Molecular Formula
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InquiryCOASDS

Product Description

Purity
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Form
100% solids, silica-filled
Synonyms
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PubChem ID
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InChIKey
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Storage
Room Temperature
Details
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